Method and apparatus for coupling a semiconductor die to die terminals

ABSTRACT

A method and apparatus for coupling a semiconductor die to terminals of a die package in which the die is housed. The apparatus comprises a die having first and second terminals. A first conductive member is elongated between a first end portion and a second end portion thereof such that the second end portion is proximate to the first terminal. A second conductive member is elongated between a first end portion and second end portion thereof such that the second end portion of the second conductive member is proximate to the second terminal of the die and the second conductive member is generally parallel to the first conductive member. The second end portions of the first and second conductive members may be coupled with conductive couplers to the first and second die terminals, respectively. The conductive members and conductive couplers may be sized and shaped to produce a selected capacitance and/or a selected impedance at the die terminals. The first and second conductive members may each have an intermediate portion between the first and second end portions thereof that is narrower than the second end portions thereof, and the conductive members may be staggered by axially offsetting the second end portion of the second conductive member from the second end portion of the first conductive member.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of pending U.S. patent application Ser. No. 09/054,275, filed Apr. 2, 1998.

TECHNICAL FIELD

The present invention is directed toward a method and apparatus for coupling a semiconductor die to die terminals.

BACKGROUND OF THE INVENTION

Semiconductor dies are typically encased in a plastic shell or package prior to installation in microelectronic devices. The plastic package makes the die easier to handle during installation and protects the die from dust, dirt and other contaminants after it has been installed. The package includes package terminals, such as pins or other similar devices which have one end coupled to the bond pads of the die and an opposite end accessible outside the package. The ends of the package terminals accessible outside the package may be coupled to other microelectronic components, linking the die to those components.

FIG. 1 is a top isometric view of a representative conventional die package 10. FIG. 2 is a partially broken top plan view of the conventional die package 10 shown in FIG. 1. Referring to FIGS. 1 and 2, the die package 10 comprises a plastic body 12 housing a die 20 therein. For purposes of clarity, the top portion of the body 12 is shown in phantom lines in FIG. 1 and partially broken away in FIG. 2. The die 20 includes bond pads 21 that are coupled to circuitry within the die. The bond pads 21 are also coupled with wire bonds 50 to leadfingers 40 that extend outwardly away from the die to the edges of the die package 10 where they are coupled to pins 30. The pins 30 project outwardly beyond the edges of the body 12 and may be coupled with other electronic components in a conventional manner so that the die 20 may communicate with the other components.

One problem with the conventional die package 10 described above is that the leadfingers 40 may limit the minimum size of the die package and die 20. The ends of the leadfingers 40 must have a surface area which is large enough to permit the bond wires 50 to be easily coupled thereto. The leadfingers 40 must also be large enough to secure the die 20 in a selected position as the die is encapsulated in the body 12 during manufacture of the die package 10. The large surface area of the leadfingers 40 and the spacing between adjacent leadfingers may limit the minimum size of the die package 10. The size and spacing of the leadfingers 40 may also limit the minimum distance between the corresponding bond pads 21 to which the leadfingers are connected and may accordingly limit the minimum size of the die 20.

Another problem with the conventional die package 10 described above is that the leadfingers 40 may increase the capacitance measured at the pins 30, thereby reducing the speed with which signals may propagate between the pins 30 and the corresponding bond pads 21. The reduced signal speed may decrease the overall speed and efficiency of the die 20 and the microelectronic components with which the die is coupled.

Yet another problem with the conventional die package 10 shown in FIGS. 1 and 2 is that an impedance measured at one of the pins 30 may be different than an impedance measured at another pin 30. The impedance mismatch between pins 30 of the same die 20 probably adversely affects the relative timing of signals coupled to the die through different pins 30.

In another conventional arrangement (not shown), the die 20 may be coupled to leadfingers 40 which are positioned directly on the surface of a printed circuit board. The printed circuit board may then be coupled to other microelectronic devices or other printed circuit boards. This alternate arrangement may suffer from the same problems discussed above, including a limited minimum die size, reduced signal speed and mismatched impedances.

SUMMARY OF THE INVENTION

The present invention is directed toward a method and apparatus for coupling a semiconductor die to terminals of a die package or printed circuit board which supports the die. An apparatus in accordance with one embodiment of the invention includes a microelectronic device comprising a semiconductor die having at least one terminal. The microelectronic device further comprises a conductive member elongated between a first end portion and a second end portion. The second end portion is proximate to the terminal of the die. The conductive member has an intermediate portion between the first and second end portions that is narrower than the second end portion. In one embodiment, the second end portion is positioned adjacent the semiconductor die, and in another embodiment, the second end portion is positioned on a surface of the semiconductor die. In either embodiment, the second end portion may be coupled to the die terminal with a conductive coupler.

In another embodiment of the invention, the microelectronic device comprises a package having first and second package terminals and a semiconductor die positioned within the package and having first and second die terminals. A first conductive member is coupled at one end to the first package terminal. A first conductive coupler is coupled between the first die terminal and the first conductive member. The microelectronic device further comprises a second conductive member coupled at one end to the second package terminal. A second conductive coupler is coupled between the second die terminal and the second conductive member. The first conductive member and first conductive coupler are selected to produce a first impedance at the first package terminal and the second conductive member and second conductive coupler are selected to produce a second impedance at the second package terminal. The first and second impedances are selected to be approximately equal.

In still another embodiment, the semiconductor die may be positioned on the surface of a printed circuit board or other substrate. The substrate may include conductive members that are offset relative to each other and the semiconductor die. The conductive members may be coupled to the die terminals with conductive couplers and may also be connected to vias in the substrate.

The present invention is also embodied in a method for positioning conductive members proximate to first and second adjacent terminals of a semiconductor die. In one embodiment, the method comprises positioning an end of a first conductive member proximate the first terminal of the die and positioning an end of a second conductive member proximate the second terminal of the die. The ends of the first and second conductive members are staggered such that the end of the second conductive member is spaced apart from the second terminal by a distance which is greater than the distance between the end of the first conductive member and the first terminal.

The present invention is also embodied in a method for selecting the impedance of a conductive path between a terminal of a semiconductor die and a terminal of a package in which the die is housed. In one embodiment, the method comprises selecting a size and material of a conductive member to have a first impedance and selecting a size and material of a conductive coupler to have a second impedance. The conductive member has first and second opposite ends and the method further comprises connecting the first end of the conductive member to the terminal of the package and connecting the conductive coupler to extend between the terminal of the die and the second end of the conductive member.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top isometric view of a die package in accordance with the prior art.

FIG. 2 is a partially broken top plan view of the die package shown in FIG. 1.

FIG. 3 is a partially broken top plan view of a die package having staggered conductive members extending over a surface of a semiconductor die in accordance with one embodiment of the invention.

FIG. 4 is a partially broken top plan view of a die package having staggered conductive members and the same number of package terminals as shown in FIG. 1, housing a die with an increased number of die terminals, in accordance with another embodiment of the invention.

FIG. 5 is a partially broken top plan view of a die package having staggered conductive members and the same number of package terminals as shown in FIG. 1, housing a die with closely spaced die terminals in accordance with another embodiment of the invention.

FIG. 6 is a top plan view of a lead frame for supporting the conductive members shown in FIG. 4.

FIG. 7 is a partially broken top plan view of a die package having staggered conductive members positioned proximate a semiconductor die in accordance with another embodiment of the invention.

FIG. 8 is a partially broken top plan view of a die package having conductive members and conductive couplers of varying lengths in accordance with yet another embodiment of the invention.

FIG. 9 is an isometric view of the top surface of a portion of a substrate having staggered conductive members thereon and a bottom isometric view of a die having correspondingly positioned solder balls.

FIG. 10 is an isometric view of the top surface of a portion of a substrate having enlarged staggered conductive members thereon and a bottom isometric view of a die having correspondingly positional solder balls.

FIG. 11 is a top isometric view of a die mounted to a substrate having staggered conductive members in accordance with another embodiment of the invention.

FIG. 12 is a schematic of a computer having a die package in accordance with still another embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is embodied in an apparatus and method for coupling terminals of a die to terminals of a die package or printed circuit board which supports the die. An aspect of the invention is that conductive members which extend between the die terminals and the package terminals may be staggered to increase the number of conductive members and die terminals that may be positioned in a given die package. A further aspect of the invention is that the conductive members may be connected to the die terminals with conductive couplers, and the size and composition of the conductive members and conductive couplers may be selected to produce a selected impedance at the package terminals. FIGS. 3-10 illustrate various embodiments of the apparatus and methods, and like reference numbers refer to like parts throughout the figures.

FIG. 3 is a top plan view of a representative die package 110 in accordance with an embodiment of the invention. The die package 110 generally comprises a solid plastic body 112 which is shown partially broken away and which encapsulates a semiconductor chip or die 120. The die 120 has die terminals or bond pads 121 which are coupled with conductive couplers 150 and conductive members 140 to package terminals 130 positioned along the edges 113 of the body 112. The package terminals 130 project away from the body 112 so that they may be easily coupled to other microelectronic components.

The body 112 may comprise a plastic or other suitable insulating material. As shown in FIG. 3, the die 120 may be centered within the body 112 and may include die terminals 121 which are aligned along a central axis of an upper surface 122 of the die. In other embodiments, the die terminals 121 may have other configurations, as will be discussed in greater detail below with reference to FIG. 7. In one embodiment, the die terminals 121 may comprise conventional bond pads, as shown in FIG. 3, and may comprise solder balls, as will be discussed in greater detail below with reference to FIGS. 9 and 10, or other terminal devices in other embodiments.

The conductive members or leads 140 extend over the upper surface 122 of the die 120 in a “lead-over-chip” configuration so as to be proximate to the die terminals 121. The upper surface 122 of the die 120 accordingly comprises an insulating layer to electrically isolate the conductive members 140 from each other. The conductive members 140 may be adhesively bonded to the die 120 to hold the die 120 in position during manufacturing, as will be discussed in greater detail below with reference to FIG. 5.

Each conductive member 140 is elongated and has a bonding portion 142 at one end, a terminal portion 143 at an opposite end, and an intermediate portion 144 extending between the bonding portion and the terminal portion. Each bonding portion 142 is connected with a conductive coupler 150 to the corresponding die terminal 121. The conductive couplers 150 may comprise gold wire, aluminum wire, a conductive adhesive, or other suitable conductive materials which have a low resistance and may be easily bonded to the bonding portion 142 with a mechanical or chemical/mechanical bond. Each bonding portion 142 has a width sufficient to keep the bonding portion stable when the conductive coupler 150 is connected thereto. Accordingly, the bonding portion 142 may have a width of approximately 0.008 inch in one embodiment and may have other widths in other embodiments.

The intermediate portion 144 of each conductive member 140 has a width which is less than the width of the bonding portion 142 and less than the width of the conventional leadfingers 40 shown in FIGS. 1 and 2. Accordingly, the spacing between adjacent conductive members 140 may be reduced by positioning the bonding portion 142 of one conductive member adjacent the intermediate portion 144 of the neighboring conductive member. Each conductive member 140 may be axially offset relative to its neighbor, producing a staggered pattern of conductive members, as shown in FIG. 3.

In one embodiment, the intermediate portions 144 have a width of approximately 0.004 inch. The intermediate portions 144 may have other widths in other embodiments, so long as the intermediate portions are narrow enough to allow adjacent conductive members 140 to be staggered, as shown in FIG. 3, and wide enough to support the die 120 in position when the body 112 is formed around the die. Furthermore, if the intermediate portions 144 are too narrow, the conductive members 140 may tend to curl or otherwise bend away from the die 120, making it difficult to attach the conductive members to the die, and making it difficult to attach the conductive couplers 150 to the conductive members. Accordingly, the intermediate portions 144 may be wide enough in one embodiment to keep the conductive member 140 substantially flat against the upper surface 122 of the die 120.

The terminal portion 143 of each conductive member 140 is connected to a corresponding package terminal 130, as shown in FIG. 3. The package terminals 130 may comprise pins in one embodiment and may comprise other types of terminals or connectors in other embodiments. In one embodiment, the bonding portion 142, intermediate portion 144, and terminal portion 143 are formed integrally with each other and with the corresponding package terminal 130, as will be discussed in greater detail below with reference to FIG. 5.

One advantage of the conductive members 140 shown in FIG. 3 is that they may be spaced more closely together than conventional leadfingers. Accordingly, an increased number of conductive members 140 may be positioned on the upper surface 122 of the die 120, as may be seen by comparing the die package 110 shown in FIG. 3 with the conventional die package 10 shown in FIG. 2. The die package 110 shown in FIG. 3 has sixteen conductive members 140, while the conventional die package 10 shown in FIG. 2 has only fourteen leadfingers 40 positioned on a die 20 having the same dimensions as the die shown in FIG. 3. The die package 110 may have a greater or lesser number of conductive members 140 in alternate embodiments. The increased number of conductive members 140 may provide the connections necessary to transmit signals to and/or from an increased number of die terminals 121.

A further advantage of the conductive members 140 is that the relatively narrow intermediate portions 144 thereof reduce the overall size, and therefore capacitance, of each conductive member when compared with a conventional leadfinger. The conductive members 140 may accordingly transmit signals to and/or from the die terminal 121 at a faster rate than the conventional leadfingers 40 shown in FIGS. 1 and 2.

In the embodiment shown in FIG. 3, the die package 110 has an increased number of die terminals 121, conductive members 140, and package terminals 130 when compared to the conventional die package 10 shown in FIG. 2. In another embodiment shown in FIG. 4, the die package 110 a may have the same number and spacing of package terminals 130 as the conventional die package 10, so as to be compatible with devices configured to be coupled to the conventional die package. The die package 110 a may have an increased number of conductive members 140 and die terminals 121, as discussed above with reference to FIG. 3, so long as the additional conductive members 140 are coupled to existing package terminals 130. Accordingly, two pairs of conductive members 140 a and 140 b are each connected to existing package terminals 130 a. The die package 110 a accordingly has twelve package terminals, as does the conventional die package 10 shown in FIG. 2. The die package 110 a has sixteen conductive members 140 and die terminals 121, as compared with the conventional die package 10 shown in FIGS. 1 and 2 which has only fourteen leadfingers 40 and bond pads 21.

An advantage of the die package 110 a shown in FIG. 4 is that it may include a die 120 having an increased number of die terminals 121 while the die package itself has the same number of package terminals 130 as a conventional package. The increased number of die terminals 121 may increase the performance of the die, as discussed above with reference to FIG. 3. Furthermore, because the die package 110 a has the same number of package terminals 130 as a conventional die package, it may be easily coupled to the same devices as is a conventional die package.

FIG. 5 is a partially broken top plan view of a die package 110 b housing a reduced size die 120 a in accordance with another embodiment of the invention. The die 120 a has the same number of die terminals 121 as does the conventional die 20 shown in FIGS. 1 and 2. The die terminals 121, however, are more closely spaced than are the bond pads 20 shown in FIG. 2. Accordingly, the overall size of the die 120 a may be reduced when compared to the overall size of the die 20 shown in FIG. 2. As shown in FIG. 5, the conductive members 140 are staggered so as to remain proximate to the corresponding die terminals 121. As a result, the overall size of the die package 110 b may be reduced when compared to the die package 10 shown in FIG. 2. This configuration is advantageous where it is desirable to reduce the size of the die 120 a and/or the package 112 housing the die, as is the case in any number of myriad of microelectronic applications.

FIG. 6 is a top plan view of a lead frame 141 formed during manufacture of the die package 110 a discussed above with reference to FIG. 4. A similar lead frame may be formed during manufacture of the die packages 110, 110 b discussed above with reference to FIGS. 3 and 6. The lead frame 141 comprises conductive members 140 substantially identical to those shown in FIG. 4, except that the conductive members each include an elongated portion 146 extending outwardly away from the terminal portions 143 thereof. The elongated portions 146 are connected with connective portions 147 so that each conductive member 140 has a fixed location relative to the other conductive members. In one embodiment, the lead frame 141 may be etched from a sheet of metallic material, such as a nickel/iron alloy, a copper alloy or another suitable conductive material. In another embodiment, the lead frame 141 may be stamped from a metallic sheet. Other manufacturing methods may be used in further embodiments.

As shown in FIG. 6, the die package 110 a may be formed by attaching the lead frame 141 to the die 120 and then encapsulating the die and a portion of the lead frame in the body 112, the edges 113 of which are shown in phantom lines in FIG. 6. In one embodiment, the lead frame 141 may be attached to the die by adhesively bonding the conductive members 140 to the upper surface 122 of the die 120 such that the bonding portions 142 of the conductive members are adjacent the corresponding die terminals 141. The conductive couplings 150 (FIG. 4) may be connected between the die terminals 121 and the bonding portions 142 without substantial risk that the die will move relative to the conductive members 140 and potentially disrupt the coupling established therebetween. The lead frame 141 may then be clamped between two halves of a mold (not shown), the inner edges of which correspond to the outer edges 113 of the body 112. The mold may be filled with a liquid or flowable non-conductive encapsulating material which is then allowed to harden, forming the body 112. The body 112, die 120, and lead frame 141 may be removed as a unit from the mold and elongated portions 146 are trimmed along trim lines 148 to remove excess material. The residual tab portions 149 may be bent perpendicular to the body 112 to form the package terminals or pins 130 shown in FIGS. 3-5.

An advantage of the lead frame 141 shown in FIG. 6 is that it has a greater number of conductive members 140 than does a conventional lead frame. Accordingly, the lead frame 141 may provide additional support for the die 120 as it is encapsulated in the body 112, reducing the likelihood that the die may move relative to the lead frame and disturb the electrical connections formed therebetween.

FIG. 7 is a top plan view of another embodiment of a die package 110 c having conductive members 140 which extend up to but not over the die 120 b. The die 120 b has die terminals 121 spaced around the periphery thereof, proximate to the bonding portions 142 of the conductive members 140 and are bonded to the bonding portions with conductive couplings 150, substantially as discussed above with reference to FIG. 3. The conductive members 140 are sized and shaped similarly to the conductive members shown in FIG. 3, so as to create a staggered pattern of bonding portions 142. During manufacture, the conductive members 140 may be interconnected with connective portions, substantially as discussed previously with reference to FIG. 6. In addition, the connective portions may be connected to paddle fingers 161 which are in turn connected to a support paddle 160. The support paddle 160 is positioned beneath the die 120 b and has the same general plan-form shape as the die. The support paddle 160 and the paddle fingers 161 support the die relative to the conductive members 140 when the conductive members are coupled to the die terminals 121 with the conductive couplings 150.

As shown in FIG. 7, the conductive members 140 may be advantageously staggered to increase the number of conductive members which may be bonded to the die 120 b. As discussed previously with respect to FIG. 3, the die 120 b may accordingly have more die terminals 121 than a die housed in a conventional die package. The additional conductive members 140 may be coupled to a conventional number of package terminals 130, in a manner similar to that shown in FIG. 4, or to an increased number of package terminals in a manner similar to that shown in FIG. 3. In another embodiment, the number of conductive members 140 and package terminals 130 may be the same as a conventional die package, but the die 120 b and/or the die package 110 b may have a reduced size when compared to their conventional counterparts, in a manner similar to that discussed above with reference to FIG. 5.

FIG. 8 is a plan view of a die package 110 d in accordance with another embodiment of the invention having conductive members 140 and conductive couplers 150 sized to have a desired capacitance and/or impedance. As discussed above with reference to FIG. 3, the conductive couplers 150 may be formed from thin wire, having a generally circular cross-sectional shape and a relatively small surface area. The capacitance between pairs of conductive couplers 150 and/or between one conductive coupler and ground is accordingly relatively low and the conductive couplers may not significantly reduce the rate at which signals propagate between the die terminals 121 and the package terminals 130. The conductive members 140 may comprise portions of thin sheets having a relatively large surface area and the capacitance between pairs of conductive members 140 and/or between one conductive member and ground may be relatively high. On the other hand, the conductive members 140 may be stronger and more rigid than the conductive couplers 150. The conductive members 140 may accordingly form a more stable connection between the die terminals 121 and the package terminals 130, and may be less likely to break during manufacture and may be less likely to flex to such a degree as to contact adjacent conductive members.

In one embodiment, the relative lengths of the conductive couplers 150 and conductive members 140 are chosen to maintain a relatively low total capacitance while at the same time maintaining a relatively high level of stability. In another embodiment, other dimensions of the conductive couplers 150 and conductive members 140, including the widths and thicknesses thereof, may be selected to reduce the capacitance between the die terminals 121 and package terminals 130 while maintaining a stable connection therebetween which adequately supports the die 120 as the die package 110 d is manufactured.

The conductive couplers 150 discussed above may have a relatively higher inductance than the conductive members 140. Accordingly, in one embodiment, where it is desirable to reduce the overall inductance between the die terminals 121 and the package terminals 130, the length of the conductive member 140 may be increased and the length of the conductive coupler 150 may be decreased. Conversely, where the circuit design is relatively independent of inductance, the conductive couplers 150 may be as long as possible and the conductive members 140 may be as short as possible to reduce overall capacitance. In one aspect of this embodiment, the conductive members may be long enough to adequately support the die 120 as the die package 110 d is manufactured.

In still a further alternate embodiment, the conductive couplers 150 and conductive members 140 may be configured so that the impedance measured at each package terminal 130 is approximately equal even though the impedance measured at each die terminal 121 may be different. Accordingly, a die terminal 121 a having a relatively low impedance may be coupled via a relatively high impedance path to the corresponding package terminal 130 a. The high impedance path may include a short conductive coupler 150 a having a relatively low impedance coupled to a relatively long conductive member 140 c having a relatively high impedance. A die terminal 121 c having a relatively high impedance may be coupled via a relatively low impedance path to its corresponding package terminal 130 c. The low impedance path may include a long conductive coupler 150 c coupled to a short conductive member 140 c. The respective impedances of the conductive members 140 and conductive couplers 150 may be selected based on the size and/or material composition of the conductive members and couplers, as discussed above.

In yet a further alternate embodiment, the capacitances rather than the inductances measured at different package terminals 130 may be adjusted to be approximately equal by adjusting the size and/or shape of the conductive members 140 and conductive couplers 150 which extend between the package terminals 130 and the corresponding die terminals 121.

One advantage of matching the impedance and/or capacitance of the package terminals 130, as discussed above, is that the die 120 may have improved operational characteristics as a result. By equating or approximately equating the impedance and/or capacitance measured at each package terminal 130, signals propagated to and from the die 120 may tend to arrive and depart in a more synchronous fashion, increasing the likelihood that the signals will be properly synchronized with each other and with other signals generated by other devices to which the die may be connected.

FIG. 9 is an isometric view of the top surface of a substrate 126 having staggered conductive members 140 thereon. In one embodiment, the substrate 126 may comprise a printed circuit board and may comprise another semiconductor substrate in other embodiments. A semiconductor die 120 c having die terminals 121 b aligned with the conductive members 140 is shown positioned above the substrate 126 in FIG. 9. In one embodiment, the die terminals 121 b comprise solder balls which may be engaged with the bonding portions 142 of the corresponding conductive members 140. The terminal portions of the conductive members 140, not shown for purposes of clarity, may be coupled to other semiconductor dies or other components. In other embodiments, the die terminals 121 b may comprise other materials which may be heated so as to bond them to the corresponding conductive couplers 140. In still further embodiments, the die terminals 121 b may comprise other materials which may be adhesively or otherwise bonded to the corresponding conductive members 140.

As shown in FIG. 9, the conductive members 140 are staggered in a manner similar to that discussed previously with reference to FIGS. 3-8. Accordingly, an advantage of the conductive members 140 shown in FIG. 9 is that a greater number of die terminals 121 b may be positioned within a given surface area of the die 120 c.

FIG. 10 is an isometric view of the top surface of a portion of a substrate 126, such as a printed circuit board, having enlarged staggered conductive members 140 d positioned thereon. As discussed above with reference to FIG. 9, a semiconductor die 120 d having die terminals 121 b may be aligned with the substrate 126 such that the die terminals 121 b engage the bonding portions 142 a of the corresponding conductive members 140 d when the die 120 d is placed face down on the substrate. As shown in FIG. 10, the bonding portions 142 a of the conductive members 140 d are enlarged compared with the bonding portions 142 of the conductive members 140 shown in FIG. 9. Accordingly, the enlarged bonding portions 142 a shown in FIG. 10 may provide a greater bonding area and accordingly a greater bond strength between the conductive members 140 and the corresponding die terminals 121 b. Another advantage of the enlarged bonding portions 142 a is that they may still align with the corresponding die terminal 121 b even if the die 120 d itself is slightly misaligned relative to the substrate 126. Accordingly, the enlarged bonding portions 142 provide a margin for error in the alignment process. As shown in FIG. 10, the staggered arrangement of the conductive members 140 d allows enlarged bonding portions 142 to be positioned in the same area which would otherwise be occupied by conventionally sized bonding portions.

FIG. 11 is a top isometric view of a semiconductor die 220 attached to a substrate 226 having staggered conductive members 240 in accordance with another embodiment of the invention. The substrate 226 may include a printed circuit board having several layers 227 (shown as 227 a, 227 b, and 227 c) formed from organic epoxy-glass resin based materials, such as bis-maleimidie-triazine, or from a polyimide, a ceramic material, or another suitable material. The uppermost layer 227 a may include an attachment surface 228 to which the semiconductor die 220 is attached, and the lowermost layer 227 c may include a contact surface 229 opposite the attachment surface 228. A plurality of vias 252 may extend from the attachment surface 228 through the layers 227 to corresponding contacts 230 on the contact surface 229. For purposes of clarity, only one connection between a via 252 and a contact 230 is shown in FIG. 11. In one embodiment, the contacts 230 may be flush-mounted on the contact surface 229, and in other embodiments, the contacts 230 may include solder balls, such as are shown in FIG. 10, or other types of connectors. The contacts 230 may be coupled to other devices (not shown) to link the substrate 226 and the semiconductor die 220 to the other devices.

The conductive members 240 may be positioned on the attachment surface 228 proximate to the semiconductor die 220. The conductive members 240 may be coupled to the vias 252 with traces 251, and may be coupled to corresponding die terminals 221 on the semiconductor die 220 with conductive couplers 250 to transmit signals between the semiconductor die and the contacts 230. The conductive couplers 250 may comprise gold wire or other suitable conductive materials, as discussed above with reference to FIG. 3. As discussed above with respect to FIG. 8, the capacitance of the conductive couplers 250, the traces 251, and the conductive members 240 may be selected to produce a desired impedance and/or capacitance at the die terminals 221.

As shown in FIG. 11, adjacent conductive members 240 may be staggered or offset relative to one another and relative an edge 222 of the semiconductor die 220. The conductive members 240 may have a generally square shape in the embodiment shown in FIG. 11, and may have other shapes in other embodiments. In one embodiment, the conductive members 240 may be etched into the attachment surface 228, and in other embodiments the conductive members may be bonded to the attachment surface. In any of the foregoing embodiments, an advantage of the substrate 226 and the conductive members 240 shown in FIG. 11 is that an increased number of conductive members 240 may be positioned adjacent the semiconductor die 220, permitting an increased number of connections between the semiconductor die and the substrate 226.

FIG. 12 is a schematic of a computer 160 having a data input device 161 and a data output device 162. The data input and output devices 161 and 162 are coupled to circuitry 163 within the computer 160 that may include, but is not limited to, a processor 165, a memory 166 and a chipset 164. In one embodiment, the processor 165 includes a die package 110 that is generally similar to the die package shown in FIG. 3. In other embodiments, the chipset 164 and/or the memory 166 and/or other circuitry components (not shown) may include a die package 110. In still further embodiments, the circuitry 163 may include die packages generally similar to any of the die packages shown in FIGS. 4-11.

From the foregoing it will be appreciated that, although specific embodiments of the invention have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and scope of the invention. Accordingly, the invention is not limited except as by the appended claims. 

What is claimed is:
 1. A method for selecting the impedance of a conductive path between a terminal of a semiconductor die and a terminal of a package in which the die is housed, the method comprising: selecting a conductive member to have a first impedance; selecting a conductive coupler to have a second impedance; connecting a first end of the conductive member to the terminal of the package; and connecting the conductive coupler to extend between the terminal of the die and a second end of the conductive member opposite the first end of the conductive member.
 2. The method of claim 1 wherein the terminal of the semiconductor die is a first die terminal, the terminal of the package is a first package terminal, and the conductive path therebetween is a first conductive path, the die having a second die terminal, the package having a second package terminal, the method further comprising: selecting a second conductive member connected to the second package terminal and a second conductive coupler coupled between the second conductive member and the second die terminal to produce an impedance at the second package terminal approximately equal to an impedance at the first die terminal.
 3. The method of claim 1 wherein the act of selecting a conductive member includes selecting a size of the conductive member.
 4. The method of claim 1 wherein the act of selecting a conductive member includes selecting a material comprising the conductive member.
 5. The method of claim 1 wherein the act of selecting the conductive coupler includes selecting a size of the conductive coupler.
 6. The method of claim 1 wherein the act of selecting a conductive coupler includes selecting a material comprising the conductive coupler.
 7. A method for selecting the capacitance of a conductive path between a terminal of a semiconductor die and a terminal of a package in which the die is housed, the method comprising: selecting a conductive member to produce a first capacitance; selecting a conductive coupler to produce a second capacitance; connecting a first end of the conductive member to the terminal of the package; and connecting the conductive coupler to extend between the terminal of the die and a second end of the conductive member opposite the first end of the conductive member.
 8. The method of claim 7 wherein the first and second capacitances are measured relative to ground.
 9. The method of claim 7 wherein the terminal of the semiconductor die is a first die terminal, the terminal of the package is a first package terminal and the conductive path therebetween is a first conductive path, the semiconductor die having a second die terminal coupled to a second package terminal with a second conductive member and a second conductive coupler, the second conductive member and second conductive coupler comprising a second conductive path, the first and second capacitances being measured relative to the second conductive path.
 10. The method of claim 7 wherein the terminal of the semiconductor die is a first die terminal, the terminal of the package is a first package terminal, and the conductive path therebetween is a first conductive path, the die having a second die terminal, the package having a second package terminal, the method further comprising: selecting a second conductive member connected to the second package terminal and a second conductive coupler coupled between the second conductive member and the second die terminal to produce a capacitance at the second package terminal approximately equal to a capacitance at the first package terminal.
 11. The method of claim 10 wherein the capacitances at the first and second package terminals are measured relative to ground.
 12. The method of claim 7 wherein the act of selecting a conductive member includes selecting a size of the conductive member.
 13. The method of claim 7 wherein the act of selecting a conductive member includes selecting a shape of the conductive member.
 14. The method of claim 7 wherein the act of selecting the conductive coupler includes selecting a size of the conductive coupler.
 15. The method of claim 7 wherein the act of selecting a conductive coupler includes selecting a shape of the conductive coupler. 